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Thin wafer handling using mechanical- or laser-debondable temporary adhesives
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2015
Conference Paper
Titel
Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Author(s)
Fleming, D.
Kim, J.-U.
Okada, J.
Wang, K.
Gallagher, M.
Barr, B.
Calvert, J.
Zoschke, K.
Wegner, M.
Töpper, M.
Rapps, T.
Griesbach, T.
Lutter, S.
Hauptwerk
11th International Conference and Exhibition on Device Packaging 2015
Konferenz
International Conference and Exhibition on Device Packaging (DPC) 2015
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM