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In-situ measuring module for transfer molding process monitoring

: Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.


IMAPS Proceedings of the International Symposium on Microelectronics. Online journal (2016), Nr.1, Fall, S.475-477
ISSN: 2380-4505
International Symposium on Microelectronics <49, 2016, Pasadena/Calif.>
Zeitschriftenaufsatz, Konferenzbeitrag
Fraunhofer IZM ()

While Moore's Law is slowing down heterogeneous integration and System-in-Package (SiP) are taking up the challenge towards further miniaturization. To ensure reliability of these packages often encapsulation by transfer molding is used – providing a highly productive and cost effective device housing. Though transfer molding is the dominant process for microelectronics encapsulation, the process details are typically not accessible directly but only via machine settings. To understand more of the mold process further research needs to be conducted to get inside information from the process. A sensor based system was developed to in-situ measure transient material data and process parameters. The temperature of the tool and melt front, the cavity pressure and cure related dielectric material data was measured with a first prototype. Summarized this paper presents the development of a sensor based system to in-situ measure characteristic material properties and process parameters in a transfer mold machine. The in-situ measurement tool allows a live documentation, optimization and knowledge extension of transfer mold processes parallel to FEM simulation and external measuring like DSC analysis. The sensor approach can lead to material driven self-adjusting transfer mold machines with an economized process.