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Simulation driven design of novel integrated circuits - physics of failure simulation of the electronic control modules for harsh environment application

: Palczynska, Alicja; Sasi, Arun; Werner, Matthias; Prisacaru, Alexandru; Gromala, Przemyslaw; Han, Bongtae; Mayer, Dirk; Melz, Tobias


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings : 31 May-3 June 2016, Las Vegas, Nevada, USA
Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016
ISBN: 978-1-5090-1205-3 (Print)
ISBN: 978-1-5090-1204-6 (Online)
ISBN: 978-1-5090-1203-9
Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>
Fraunhofer LBF ()
physics of failure; simulation driven design; power packages

Reduction of development time of an advanced Electronic Control Unit (ECU) requires optimization of the product design at the early stage of development. A simulation driven design has been used effectively to define the ideal position of components for optimum reliability even before the first prototype is manufactured. Such methods are based on a virtual design of experiments that allows to investigate different layouts or to optimize the ECU. In this paper a physics of failure simulation of the ECU is presented for automotive applications. A test vehicle with power packages on a PCB is designed and tested to enable the analysis of system behavior with three different relative orientations of DPAKs (Discrete Package). The failure modes are identified by FMMEA, and risk assessment is conducted using a systematic simulation approach. The approach involves a sequential numerical simulation of electrical, thermal and thermomechanical analysis. The final results are analyzed with a special emphasis on the design elements, where the failure is expected.