
Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems
| Institute of Electrical and Electronics Engineers -IEEE-: IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 : Matsushima Bay and Sendai MEMS City, Japan, 17-20 April, 2016 Piscataway, NJ: IEEE, 2016 ISBN: 978-1-5090-1948-9 (Print) ISBN: 978-1-5090-1947-2 ISBN: 978-1-5090-1946-5 S.595-599 |
| International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) <11, 2016, Matsushima Bay, Sendai> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer ENAS () |
Abstract
In this paper we present a holistic wafer-level manufacturing process for nanoscopic sensor devices based on individualized single-wall carbon nanotubes (SWCNTs) integrated in MEMS. The fabrication technology is demonstrated in detail. Moreover, a first application in form of a MEMS test stage for SWCNT strain and reliability experiments is shown.