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Photomask displacement technology for continuous profile generation by mask aligner lithography

: Weichelt, T.; Kinder, R.; Zeitner, U.D.


Journal of optics 18 (2016), Nr.12, 5 S.
ISSN: 2040-8978
ISSN: 2040-8986
Fraunhofer IOF ()

Mask aligner lithography is one of the most widely used technologies for micro-optical elements fabrication. It offers a high throughput with high-yield processing. With different resolution enhancement technologies shadow printing is a mature alternative to the more expensive projection or electron-beam lithography. We are presenting a novel mask aligner tool that allows shifting the photomask with high accuracy between sequential exposure shots. It offers possibilities such as double patterning or gray tone lithography by applying different light doses at different locations. Within this publication, we show the first results for high resolution blazed grating structures generated in photoresist by multiple exposures using a conventional binary photomask.