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Study on packaging and driver integration with GaN switches for fast switching

 
: Klein, K.; Hoene, E.; Reiner, R.; Quay, R.

Energietechnische Gesellschaft -ETG-; Verband Deutscher Elektrotechniker e.V. -VDE-, Berlin:
CIPS 2016, 9th International Conference on Integrated Power Electronics Systems. Proceedings. CD-ROM : March, 8 - 10, 2016, Nuremberg/Germany
Berlin: VDE-Verlag, 2016 (ETG Fachbericht 148)
ISBN: 978-3-8007-4171-7
ISBN: 3-8007-4171-7
6 S.
International Conference on Integrated Power Electronics Systems (CIPS) <9, 2016, Nuremberg>
Englisch
Konferenzbeitrag
Fraunhofer IAF ()

Abstract
This paper gives a short overview of opportunities coming with new technologies in packaging and driver integration offered by high voltage GaN power semiconductors. Understanding of the GaN features inspires to ideas for possible onolithic integrations and solutions on semiconductor level. Understanding of assembly parasitics influencing fast witching allows designing of an ideal GaN package presented in this paper and suited to generate the most benefit from the semiconductor.

: http://publica.fraunhofer.de/dokumente/N-431745.html