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2016
Conference Paper
Titel
ATHENIS-3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
Alternative
ATHENIS 3D: Automobiltaugliche Hochvolt- und integrierte NVM SoC Plattofrm mit 3D Technologie
Abstract
The ATHENIS-3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile Magnetic RAM), circuit-level (inductorless high-voltage DC-DC converter, high-temperature 28nm System-on-Chip platform) and system-level (compact 3D embedded power mechatronic system). Enabling high integration levels of complex systems, operating in harsh environments, in a single packaged 3D device, ATHENIS-3D allows for one order of magnitude area reduction vs. today PCB-based power and control systems. Integration costs will be consequently reduced in key industrial sectors for Europe where high-voltage/temperature operations are mandatory (vehicles, avionics, space/defense, industrial automation, energy). © 2016 EDAA.
Author(s)
Language
English
Tags
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3D technology
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electric vehicles
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integrated passive devices
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power electronics
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System-on-chip/in-package (SoC/SiP)
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Application specific integrated circuits
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Automation
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Chip scale packages
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DC power transmission
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DC-DC converters
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Electric vehicles
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Magnetic levitation vehicles
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Power electronics
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Programmable logic controllers
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System-on-chip
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Three-dimensional integrated circuits
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Vehicles 3D technology
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Enabling technologies