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Laser encapsulation of organic electronics with adapted diode lasers in flexible production processes

: Brosda, M.; Olowinsky, A.; Pelzer, A.

Volltext (PDF; )

Physics procedia 83 (2016), S.218–224
ISSN: 1875-3892
ISSN: 1875-3884
International Conference on Laser Assisted Net Shape Engineering (LANE) <9, 2016, Fürth>
Konferenzbeitrag, Zeitschriftenaufsatz, Elektronische Publikation
Fraunhofer ILT ()

Flexible organic electronics such as OLPV and OLED modules are highly sensitive against water and oxygen. To protect them against the environment and to ensure a long lifetime visual transparent ultra high barrier films are used for the encapsulation process. These multilayer films usually consist of a polymer substrate on which, depending on the requirements, various functional layers are applied. The organic device is then fully packed in this films. Instead of conventional joining these film with adhesive, a flexible laser based process can be an interesting alternative especially for roll2roll applications. According to a precise spectral analysis and a consideration of the interaction between the laser radiation and the individual layers of the film a suitable laser beam source is selected. With this laser beam source the weldability of the films is investigated. For analysis of the weldseam and the melted volume cross sections and scanning-electron-microscopy-images are prepared. The strength of the weld is determined by T-Peel tensile tests.