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2015
Conference Paper
Titel
Investigation of room-temperature flip chip connections
Abstract
A new flip chip bonding method using a special developed bump structure will be described in this paper. The interconnection is based on plug and socket structures which have been deposited by electroplating on silicon wafers. The plug structure (micro-plug) is a so called mushroom-bump with well-defined overplating. The socket is a barrel-bump structure with an adapted inner diameter. During the bonding process the plug is pressed into the socket to form a force-fitting bond. The process runs with a defined pressure and can be performed at room temperature. The electrical interconnection between temperature sensitive substrates like GaAs, CdTe or bio-functionalized Chips will be possible with the described bonding method.