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Development of a package for a triaxial high-g accelerometer optimized for high signal fidelity

: Langkemper, R.; Külls, R.; Wilde, S.; Schopferer, S.; Nau, S.

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COMSOL Conference 2016. User Presentations. Online resource : October 12-14, 2016, Munich
Munich, 2016
6 S.
COMSOL Conference <2016, Munich>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer EMI ()

In this work a package for a triaxial piezoresistive high-g acceleration sensor is developed. The sensor part consists of three sensor chips placed in a ceramic plate. This sensing element is modeled and simulated within the package including the thin adhesive layers. We examine the behavior at different excitation frequencies. Due to resonance effects the sensitivity of the sensor increases at higher frequencies. The influence of the single Eigen modes is analyzed and the essential modes are identified. Within the experiments the influence of the Eigen frequencies on the sensor signal is investigated and the sensitivity of the sensor is tested for a transient impulse. The experimental results fit quite well with the expected values given by the simulation. So the simulation could be verified with the experiments.