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Solderjet bumping - Laser soldering for high precision system integration

: Burkhardt, T.; Mohaupt, M.; Zaage, B.; Beckert, E.; Eberhardt, R.; Tünnermann, A.

Geßner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2016. Proceedings : International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick
Auerbach: Verlag Wissenschaftliche Scripten, 2016
ISBN: 978-3-95735-040-4
ISBN: 3-95735-040-9
Smart Systems Integration Conference (SSI) <2016, Munich>
International Conference and Exhibition on Integration Issues of Miniaturized Systems <10, 2016, Munich>
Fraunhofer IOF ()

System integration of complex and demanding micro-systems requires advanced packaging technologies. Laser-based soldering processes allow the joining of heterogenous materials in a flux-free and clean environment. This material fit bonding replaces organic adhesives and enables the minimization of the bonding area and therefore the miniaturization of components and respective systems. The all-inorganic joints are beneficial for harsh environmental conditions, applications for deep UV, under high energetic radiation, or for vacuum operation. We present the laser-based Solderjet Bumping is as a technique for the precision joining of a micro-structured silicon device and ceramic system platform with high post bond accuracy. An overview of the improvements in design and processing for the assembly of an advanced Multi-Beam Deflector for Multi Shaped Electron Beam Lithography are discussed.