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2016
Conference Paper
Titel
Flexible assembly module for beam-shaping product families based on support structures
Abstract
Depending on the application, high-power diode lasers (HPDL) have individual requirements on their beam-shaping as well as their mechanical fixation. In order to reduce assembly efforts, laser system manufacturers request pre-assembled beam-shaping systems consisting of a support structure for adhesive bonding as well as one, two or more lenses. Therefore, manufacturers of micro-optics for HPDL need flexible solutions for assembling beam-shaping subassemblies. This paper discusses current solutions for mounting optical subassemblies for beam-shaping of high-power diode lasers and their drawbacks regarding quality and scalability. Subsequently, the paper presents a device which can be used for the sensor-guided assembly of beam-shaping systems based on bottomtab support structures. Results from test productions of several hundred modules are presented showing that repeatability in the range of 1 μm is feasible on an industrial level.
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