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A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils

 
: Palavesam, N.; Landesberger, C.; Kutter, C.; Bock, K.

Geßner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2016. Proceedings : International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick
Auerbach: Verlag Wissenschaftliche Scripten, 2016
ISBN: 978-3-95735-040-4
ISBN: 3-95735-040-9
S.122-129
Smart Systems Integration Conference (SSI) <2016, Munich>
International Conference and Exhibition on Integration Issues of Miniaturized Systems <10, 2016, Munich>
Englisch
Konferenzbeitrag
Fraunhofer EMFT ()

Abstract
We present a new test method developed, by merging Acoustic Emission testing and Ball-Breaker Test, to study the fracture strength of very small, ultra-thin chips integrated in foils. The test method is particularly useful for strength and mechanical reliability assessment of components for wearables, flexible electronics and portable devices. Statistical results from the breaking tests revealed an increase in robustness of the ultra-thin chips of up to 300% due to embedding in foils.

: http://publica.fraunhofer.de/dokumente/N-422600.html