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Laser-based soldering technique for hermetical sealing of the calibration target for the exomars' Raman instrument

: Burkhardt, T.; Seifert, M.; Ribes, P.; Lange, N.; Lopez-Reyes, G.; Moral-Inza, A.; Sansano, A.

Ribeiro, P.A. ; Institute for Systems and Technologies of Information, Control and Communication -INSTICC-, Setubal:
PHOTOPTICS 2016. Proceedings of the 4th International Conference on Photonics, Optics and Laser Technology : Rome, Italy, February 27-29, 2016
Setubal: SciTePress, 2016
ISBN: 978-989-758-174-8
International Conference on Photonics, Optics and Laser Technology (PHOTOPTICS) <4, 2016, Rome>
Fraunhofer IOF ()

We propose the laser-based Solderjet Bumping as a full inorganic joining technique for the hermetical sealing of a possible calibration target container for the ExoMars Raman Laser Spectrometer. This technique allows the adhesive free bonding in a flux free and localized soldering process. We show a finite elements analysis based optimization of a soldering adapted design for the calibration target container. Current experimental results document hermetical sealing of a stainless steel tube with BK7 and D263 windows with a helium leakage rate down to 5·10-6 mbar·l·s-1.