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Development of advanced power modules for electric vehicle applications

: Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S.

International Microelectronics and Packaging Society -IMAPS-; Institute of Electrical and Electronics Engineers -IEEE-:
20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-0-9568086-1-5
ISBN: 978-0-9568086-2-2
European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>
Fraunhofer IZM ()

This paper discusses the manufacturing aspects for Insulated-Metal-Substrates (IMSs) with respect to high thermal conductive prepregs used and the Cu/prepreg/Cu stacks selected for each power application in the project. The IMS heat spreaders serve as high-current PCBs and heat dissipation routes for double side cooling of the Embedded power cores. The interconnection of the embedded power cores to the IMS high-current PCBs/heat spreaders is realised by silver sintering at the copper pads metallised by Ni/Au. The sintering technology is being developed and has yielded sinter deposits of 35-52βm with single or double printing. Sintering takes place at a reduced pressure of 30 bar, which is actually the needed lamination pressure. The whole stack then is a power module with double side cooling.