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Application of the IForce piezoresistive silicon based stress sensor for prognostic and health monitoring methods

: Palczynska, A.; Wu, B.; Kim, D.-S.; Gromala, P.; Han, B.; Mayer, D.; Melz, T.

International Microelectronics and Packaging Society -IMAPS-; Institute of Electrical and Electronics Engineers -IEEE-:
20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-0-9568086-1-5
ISBN: 978-0-9568086-2-2
European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>
Fraunhofer LBF ()

Miniaturization and simultaneous increase of complexity and functionality of modern electronic control units (ECU) leads to the situation that the classical reliability methods become less and less sufficient. Reliability prediction in automotive industry is complex, as the load history on the system level (e.g. car) is multi-domain and depends on many different factors such as the climate, the type of the car, user, etc. Currently, the reliability of the ECU's is assessed on the subsystem level. In order to assess reliability on the system level, prognostic and health monitoring (PHM) is the most promising method. In this paper the IForce, piezoresistive, silicon based stress sensor is implemented to monitor the stress state during passive and active power cycling (APC) of the ECU. Two ECU's-original and overmolded are subjected to combined active power and passive thermal cycling. The active power is dissipated in the commercially available DPAK IC package.