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Enhancement of the partial discharge inception voltage of ceramic substrates for power modules by trench coating

: Waltrich, U.; Bayer, C.F.; Reger, M.; Meyer, A.; Tang, X.; Schletz, A.


Institute of Electrical and Electronics Engineers -IEEE-; Japan Institute of Electronics Packaging -JIEP-; IEEE Components, Packaging, and Manufacturing Technology Society; International Microelectronics and Packaging Society -IMAPS-:
International Conference on Electronics Packaging, ICEP 2016 : April 20-22, 2016, Sapporo, Japan
Piscataway, NJ: IEEE, 2016
ISBN: 978-4-904090-17-6 (Online)
ISBN: 978-4-9040-9016-9 (CD-ROM)
ISBN: 978-1-5090-1927-4 (Print)
International Conference on Electronics Packaging (ICEP) <2016, Sapporo>
Fraunhofer IISB ()

Due to the ongoing development of high-blocking semiconductors the installed ceramic circuit boards in power modules, such as DBC (Direct Bond Copper) or AMB (Active Metal Brazed) substrates, will have to isolate high voltages (HV) beyond 6.5 kV in the near future with high lifetime and reliability. Such high blocking voltages and the correlating increased electrical field strengths induce partial discharges (PD) in the ceramic substrate as well in the encapsulating organic materials, which represent a key degradation mechanism of HV power modules. In this work a promising novel coating technology for ceramic substrate trenches, significantly enhancing the partial inception voltage (PDIV) of these substrates, is presented. The coating works as a refractive field control and reduces the field strengths in the most critical section for PD - the so-called triple point - between ceramic, encapsulate and copper metallization.