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Advanced detection method for polymer residues on semiconductor substrates

3D/TSV/interposer. Through silicon via and packaging
: Richter, H.; Pfitzner, L.; Pfeffer, M.; Bauer, A.; Siegert, J.; Bodner, T.


Institute of Electrical and Electronics Engineers -IEEE-:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). Proceedings : 16-19 May 2016, Saratoga Springs, NY
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-0270-2
ISBN: 978-1-5090-0271-9
Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) <27, 2016, Saratoga Springs/NY>
Fraunhofer IISB ()

A novel inspection technology for detection of thin polymer layers, deposited on structured silicon wafer surfaces, has been developed. The labeling of polymer residues with fluorophore combined with the subsequent examination under a fluorescence microscope enables a non-destructive detection of amorphous and semi-crystalline polymers and polymer residues on wafer substrates.