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Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K

: Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Proceedings : May 31 - June 03, 2016, Las Vegas, Nevada, USA
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-4799-5266-3
ISBN: 978-1-4673-8121-5
ISBN: 978-1-4673-8120-8
ISBN: 978-1-4673-8122-2
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <15, 2016, Las Vegas/Nev.>
Fraunhofer ENAS ()

Heat dissipation from 3D chip stacks can cause large thermal gradients due to the accumulation of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance and thereby the thermal gradients, this publication will provide an overview of several studies on the formation of sequential thermal underfills that result in percolation and quasi-areal thermal contacts between the filler particles in the composite material. The quasi-areal contacts are formed from nanoparticles self-assembled by capillary bridging, so-called necks. Thermal conductivities of up to 2.5 W/m-K and 2.8 W/m-K were demonstrated experimentally for the percolating and the neck-based underfills, respectively. This is a substantial improvement with respect to a state-of-the-art capillary thermal underfill (0.7 W/m-K).