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Properties and reliability of molybdenum-copper-composites for thermal management applications

 
: Seiss, M.; Mrotzek, T.; Hutsch, T.; Knabl, W.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Proceedings : May 31 - June 03, 2016, Las Vegas, Nevada, USA
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-4799-5266-3
ISBN: 978-1-4673-8121-5
ISBN: 978-1-4673-8120-8
ISBN: 978-1-4673-8122-2
S.971-975
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <15, 2016, Las Vegas/Nev.>
Englisch
Konferenzbeitrag
Fraunhofer IFAM, Institutsteil Pulvermetallurgie und Verbundwerkstoffe Dresden ()

Abstract
Multilayered composites made of molybdenum and copper combine a low coefficient of thermal expansion with a high thermal conductivity. By varying the layer structure, both properties can be tailored to the application requirements. Therefore, these composites are interesting candidates for the thermal management of electronics in general and especially for thermal management of GaN based devices. In this work reliability tests were performed on a three layered structure (Cu-Mo-Cu) with 63 wt% copper according to EN 60068-2-14. The results show that the interface is not degrading by thermal cycling between -40 °C and +125 °C after 2000 cycles. Moreover, no change in thermal conductivity or flatness of the samples was observed. The molybdenum-copper-interface was found to be stable up to the melting point of copper.

: http://publica.fraunhofer.de/dokumente/N-422216.html