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Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips

: Hoose, T.; Billah, M.; Blaicher, M.; Marin, P.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Möhrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M.L.; Freude, W.; Koos, C.


Optical Society of America -OSA-, Washington/D.C.; IEEE Communications Society; IEEE Photonics Society:
Optical Fiber Communications Conference and Exhibition, OFC 2016 : 20-22 March 2016, Anaheim, California, United States
Washington, DC: OSA, 2016
ISBN: 978-1-943580-07-1
Paper M2I.7
Optical Fiber Communication Conference and Exposition (OFC) <2016, Anaheim/Calif.>
Fraunhofer HHI ()

We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers.