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Thin-film deposition processes

 
: Pflug, A.; Siemers, M.; Melzig, T.; Keunecke, M.; Schäfer, L.; Bräuer, G.

:

Schmitz, G.J.:
Handbook of software solutions for ICME
Weinheim: Wiley-VCH, 2016
ISBN: 3-527-69356-4
ISBN: 978-3-527-69356-6
ISBN: 3-527-69359-9
ISBN: 978-3-527-69359-7
ISBN: 3-527-33902-7
ISBN: 3-527-69357-2
ISBN: 3-527-69358-0
ISBN: 978-3-527-33902-0
ISBN: 978-3-527-69358-0
ISBN: 978-3-527-69357-3
S.157-189
Englisch
Aufsatz in Buch
Fraunhofer IST ()
chemical vapor deposition; film structure; physical vapor deposition; sputter deposition; vacuum-based deposition technology; wet-chemical-based electroplating processes

Abstract
This chapter presents examples to demonstrate that in thin-film deposition the intrinsic film properties result from a complex interaction between the possible atomic bond structures, the deposition process conditions as well as the condition of the substrate, the previous layer structure, and the subsequent processes. It presents various technical issues and applications in thin-film deposition with representative examples. The chapter gives an overview of vacuum-based deposition technology. It explains the basic principles and applications of wet-chemical-based electroplating processes. The chapter focuses on sputter deposition with an introduction on physical vapor deposition (PVD) and chemical vapor deposition (CVD) processes. Thin-film deposition is based on the exposure of a precursor to a substrate, subsequent chemical or physical reactions between precursor and substrate surface, resulting in a growing film and formation of specific structures. During this process, the substrate surface can be additionally modified by energetic supply causing changes in film structure.

: http://publica.fraunhofer.de/dokumente/N-421499.html