Abstract
A highly promising concept for solar cells in the future is the HJT-architecture. To reach high cell performances up to 25 % efficiency, low contact and finger resistances in the metallization are necessary. Actual commercial pastes converge this aim, but are difficult to handle during processing, especially regarding the storage conditions. A new paste for HJT-wafer was developed which performs on the same level or even higher than current commercial paste, but is much more robust in processing. Improving the conductivity of such silver-polymer pastes using additives like low melting point alloys or bimodal silver mixtures is shown.