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Purpose, potential and realization of chip-attached micro-pin fin heat sinks

 
: Conrad, M.; Diatlov, A.; De Doncker, R.W.

:

Microelectronics reliability 55 (2015), Nr.9-10, S.1992-1996
ISSN: 0026-2714
Englisch
Zeitschriftenaufsatz
Fraunhofer ILT ()

Abstract
This work presents the design process of an actively cooled power semiconductor package that makes use of a structured chip contact that is preferably produced by Selective Laser Melting (SLM). The concept has a drastically reduced amount of material transitions within the cooling path and is designed for low thermo-mechanical stress. It is shown how to design and build the geometry of the integrated heat sink in such a way that plastic deformation of the applied materials is kept as low as possible. The comparison with state-of-the-art actively cooled power modules shows that a similar or even smaller thermal resistance can be achieved in a much smaller volume.

: http://publica.fraunhofer.de/dokumente/N-417863.html