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Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending

 
: Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.

:

Svasta, P. ; Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015 : Braşov, Romania, 22-25 October 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-5090-0333-4
ISBN: 978-1-5090-0331-0
ISBN: 978-1-5090-0332-7
S.367-372
International Symposium for Design and Technology in Electronic Packaging (SIITME) <21, 2015, Brasov>
Englisch
Konferenzbeitrag
Fraunhofer EMFT ()

Abstract
We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy Chain structures were measured during the tests. Resistance measurements confirmed the failure of the test samples after about 2000 bending cycles.

: http://publica.fraunhofer.de/dokumente/N-417772.html