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Combination of direct laser writing and soft lithography molds for combined nano- and microfabrication

: Rumler, Maximilian; Kollmuss, M.; Baier, L.; Michel, F.; Förthner, M.; Becker, M.; Rommel, M.; Frey, L.

Volltext urn:nbn:de:0011-n-4176702 (1.4 MByte PDF)
MD5 Fingerprint: 87c5d4f0f7ccab3ba1bd6a98eae93853
Copyright Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Erstellt am: 27.10.2016

Behringer, Uwe ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
32nd European Mask and Lithography Conference 2016 : 21-22 June 2016, Dresden, Germany
Bellingham, WA: SPIE, 2016 (Proceedings of SPIE 10032)
ISBN: 978-1-5106-0488-9
ISBN: 978-1-5106-0487-2
Paper 100320Q, 11 S.
European Mask and Lithography Conference <32, 2016, Dresden>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IISB ()
direct laser writing; nanoimprint lithography; hybrid polymer; hierarchical structures

This work presents a novel approach for combined micro- and nanofabrication based on the local laser exposure of an UV-curing material through a structured mold. The proposed process makes use of the high freedom of design of direct laser writing (DLW) and the high resolution of soft lithography molds (made e.g. from PDMS). By optimizing the exposure process it was possible to fabricate locally defined hierarchical structures with a height of around 16 μm, that are fully covered with nanometer-sized holes using OrmoComp®. Manual test imprints showed that the fabricated structures can be used for step and repeat nanoimprint processes. Furthermore, the local transfer of nanostructures into two different soft lithography resists (Katiobond 110707, mr-NIL210) was investigated. Diffusion of resist components into the PDMS mold was observed and could be prohibited by the use of hybrid molds, which employ OrmoComp® as structure containing layer. First experiments revealed successful transfer of the molds nanostructures into mr-NIL210 but still leave room for improvement concerning the process parameters.