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Debond on command: Fast debonding by exothermic reaction due to microwave activation

: Sims, Stefan; Gettwert, Volker; Urban, Helfried; Winkel, Andreas; Kahlmeyer, Martin; Böhm, Stefan

Volltext urn:nbn:de:0011-n-4023270 (265 KByte PDF)
MD5 Fingerprint: 68177d043f28d48f6c3ab211833602e1
Erstellt am: 12.7.2016

Fraunhofer-Institut für Chemische Technologie -ICT-, Pfinztal:
Energetic Materials. Synthesis, Characterization, Processing : 47th International Annual Conference of ICT, June 28 to July 1, 2016, Karlsruhe, Germany, Proceedings
Pfinztal: Fraunhofer ICT, 2016
9 S.
Fraunhofer-Institut für Chemische Technologie (International Annual Conference) <47, 2016, Karlsruhe>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ICT ()

Joining by adhesive bonding gains more interest for structural compounds, because there are many advantages in comparison to mechanical or thermal joining techniques. In addition to the environmental performance, gluing can increase cycle time in the process, while the substrates experienced no mechanical or thermal stress. The increasing applications require also a method for debonding for repairing and recycling processes. Particularly for structural adhesive bonding it does not exist today.
The presented research on debondable adhesives includes exothermic reacting materials, which are inactive during the life cycle and can be activated by microwave radiation (MW). Ionic liquids (IL) have been used as microwave absorber and, additionally, can release heat energy during the decomposition through their positive enthalpy of formation. The endothermic reaction can be used to initiate the decomposition of the added blowing agent and oxidizer, which destroys the polymeric matrix and generate additionally a mechanical blowing effect.