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A tool for generating physics-based substrate models for circuit simulation

: Scharf, Patrick; Sohrmann, Christoph

Gleichner, Christian; Vierhaus, Heinrich T.:
Dresdner Arbeitstagung Schaltungs- und Systementwurf, DASS 2016 : 10. und 11. Mai 2016, Cottbus
Stuttgart: Fraunhofer Verlag, 2016
ISBN: 978-3-8396-1046-6
Dresdner Arbeitstagung Schaltungs- und Systementwurf (DASS) <2016, Cottbus>
Bundesministerium für Bildung und Forschung BMBF
RESilient Integrated SysTems
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Reliability aspects are getting more and more important for modern microelectronics and their applications. Effects in the substrate which negatively impact robustness and reliability of a circuit is one such aspect. Cross-talk due to capacitive coupling, latch-up due to parasitic devices or avalanche generation for high currents can occur. To investigate these effects new substrate models are required for circuit simulations. Current conduction is a non-linear problem and can be solved by using a physics-based device simulator like TCAD (Technology Computer Aided Design). For high frequencies and low electric field an AC analysis provides the results for substrate cross-talk. In case of high currents and high electric fields like in an ESD (Electro Static Discharge) event the avalanche breakdown leads to current filamentation and self-heating. TCAD gives very accurate results, but only for single devices and with intolerable runtime. To improve the performance we create models for the circuit simulations out of the TCAD results. For the low field crosstalk this is achieved by simplifying the model to an RC network. In case of an ESD event by creating a mode for one dimensional conduction and connect different compact models on circuit level. In this work both models are compared to each other and the requirements on the tool are shown.