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The influence of adsorption kinetics on copper superfilling for dual damascene

: Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel

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Journal of the Electrochemical Society 163 (2016), Nr.6, S.D213-D220
ISSN: 0013-4651
ISSN: 1945-7111
ISSN: 0096-4786
Zeitschriftenaufsatz, Elektronische Publikation
Fraunhofer IPMS ()

The proceeding scaling in microelectronic devices requires smaller and smaller copper wires for energy transfer in integrated devices. Voids in the copper wires lead to a resistance increase and damage of the wiring. Copper wires are fabricated by electrochemical deposition as it enables a bottom-up, void free copper growth, so-called superfilling. The present work focuses on the mechanism of the electrochemical deposition with the goal of understanding and describing the superfilling. Electrochemical measurements and partial fill experiments under production-like conditions are carried out to study the effects of bath additives. The co-adsorption theory is adopted to explain additive interaction which is presumed to be the key for superfilling. It is shown that superfilling is a result of the synergetic adsorption behavior of at least two organic additives and a kinetic balancing between additive accumulation and copper deposition rate.