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Packaging of micro devices for automotive applications
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2003
Conference Paper
Titel
Packaging of micro devices for automotive applications
Author(s)
Jung, E.
Großer, V.
Becker, K.-F.
Koch, M.
Hauptwerk
Advanced microsystems for automotive applications 2003
Konferenz
International Conference on Advanced Microsystems for Automotive Applications 2003
DOI
10.1007/978-3-540-76988-0_4
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM