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Integrating ecodesign into the development of technology processes

: Griese, H.; Schischke, K.; Reichl, H.; Suga, T.; Stobbe, L.

Institute of Electrical and Electronics Engineers -IEEE-:
EcoDesign '03, 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing : December 8 - 11, 2003, Tokyo, Japan
Piscataway, NJ: IEEE Operations Center, 2003
ISBN: 0-7803-8590-X
International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <3, 2003, Tokyo>
Fraunhofer IZM ()

As long as product design and system technology in the field of electronics slowly consider environmental aspects, an increase in eco-efficiency of manufacturing processes is an important task for a sustainable development. Like for products the environmental as well as sustainability impact will be fixed in the first stages of the development process. Material choice, evaluation of process steps and estimated production volume determine not only production cost but they fix the overall environmental impact as well. In most cases only certain data are available and it is essential to incorporate life-cycle know how into the developing phase. Only in doing so, wrong or inefficient developments can be early identified and avoided at low cost. A successful process assessment regarding environmental impact and cost effects by cooperation of technologists and eco-designers are discussed at the example of low cost bumping technology. As a result, generalized rules for process development management drawn from these examples will be pointed out. As for further research, such ideas will be one focus of the Joint Laboratory of Fraunhofer IZM and Tokyo University (JoiLIT), which was newly established in Tokyo.