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Characterization of microcracks by application of digital image correlation to SPM images
|Meyendorf, N. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:|
Testing, reliability, and application of micro- and nano-material systems II : 15 - 17 March 2004, San Diego, California, USA
Bellingham/Wash.: SPIE, 2004 (SPIE Proceedings Series 5392)
|Conference "Testing, Reliability, and Application of Micro- and Nano-Material Systems" <2004, San Diego/Calif.>|
|Fraunhofer IZM ()|
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their broad application in a variety of market segments new reliability issues will arise. The increasing interface-to-volume ratio in highly integrated systems and nanoparticle filled materials and unsolved questions of size effect of nanomaterials are challenges for experimental reliability evaluation. To fulfill this needs the authors developed the nanoDAC method (nano Deformation Analysis by Correlation), which allows the determination and evaluation of 2D displacement fields based on scanning probe microscopy (SPM) data. In-situ SPM scans of the analyzed object are carried out at different thermo-mechanical load states. The obtained topography-, phase- or error-images are compared utilizing grayscale cross correlation algorithms. This allows the tracking of local image patterns of the analyzed surface structure. The measurement results of the nanoDAC method are full-fielddisplacement and strain fields. Due to the application of SPM equipment deformations in the micro-, nanometer range can be easily detected. The method can be performed on bulk materials, thin films and on devices i.e microelectronic components, sensors or MEMS/NEMS. Furthermore, the characterization and evaluation of micro- and nanocracks or defects in bulk materials, thin layers and at material interfaces can be carried out.