Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Bonding and contacting of MEMS-structures on wafer level

 
: Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.

Bengtsson, S. ; Electrochemical Society -ECS-, Electronics Division:
Semiconductor wafer bonding VII: Science, technology, and applications : Proceedings of the international symposium ; Seventh International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, held in April/May 2003 in Paris, France, as part of the 2003 spring meeting of the Electrochemical Society
Pennington, NJ: ECS, 2003 (Electrochemical Society. Proceedings 2003-19)
ISBN: 1-566-77402-0
S.301-308
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications <7, 2003, Paris>
Electrochemical Society (Spring Meeting) <2003, Paris>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/dokumente/N-38350.html