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In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor

 
: Palczynska, A.; Gromala, P.J.; Mayer, D.; Bongtae Han; Melz, T.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 : 19-22 April 2015, Budapest, Hungary
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-9949-1 (Print)
ISBN: 978-1-4799-9950-7
ISBN: 978-1-4799-9951-4
S.151-155
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <16, 2015, Budapest>
Englisch
Konferenzbeitrag
Fraunhofer LBF ()

Abstract
The relaxation behavior of an epoxy molding compound (EMC) subjected to a constant strain can cause new reliability challenges in automotive electronics. This problem will be exacerbated due to the ever-increasing demand in modern electronics systems for miniaturization with more functionality, yet it has not been studied extensively to mitigate its effect on reliability. In this study, a piezoresistive silicon-based stress sensor is used to understand the stress state in an ECU, more specifically the relaxation behavior of EMC caused by the storage time of an ECU (i.e., duration between production and actual usage). Mechanical stresses are measured by the piezoresistive stress sensor that is encapsulated in a standard microelectronic 3 times 3 mm land grid array (LGA) package. The relaxation behavior is observed at three different temperatures for one week: 75 degC, 100 degC and 125 degC. The relaxation behavior is measured continuously for one more week after cooling the package to room temperature (at 25 degC). An additional test is conducted at 85degC with 85% relative humidity to investigate the effect of moisture diffusion on the package. The experimental results clearly indicate that the proposed approach can be used for better understanding of the evolution of stresses in molded packages during their lifetime, especially during storage, which in turn can lead to more optimal designs in the future.

: http://publica.fraunhofer.de/dokumente/N-383287.html