Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

: Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.

DOI: 10.1109/SaPIW.2015.7237387

	Institute of Electrical and Electronics Engineers -IEEE-: IEEE 19th Workshop on Signal and Power Integrity, SPI 2015 : 10-13 May 2015, Berlin, Germany Piscataway, NJ: IEEE, 2015 ISBN: 978-1-4673-6582-6 S.26-29
	Workshop on Signal and Power Integrity (SPI) <19, 2015, Berlin>

	Englisch
	Konferenzbeitrag
	Fraunhofer IZM ()

Abstract
A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.

: http://publica.fraunhofer.de/dokumente/N-383145.html