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Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

: Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 19th Workshop on Signal and Power Integrity, SPI 2015 : 10-13 May 2015, Berlin, Germany
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4673-6582-6
Workshop on Signal and Power Integrity (SPI) <19, 2015, Berlin>
Fraunhofer IZM ()

A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.