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2015
Conference Paper
Titel
Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Abstract
A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.