Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Chip in polymer: 3D integration of active circuitry in polymeric substrate

 
: Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

:

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division:
Advances in electronic packaging 2003. Vol.1 : Presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6 - 11, 2003, Maui, Hawaii. InterPACK '03, IPACK 03
New York, NY: ASME, 2003
ISBN: 0-7918-3690-8
S.47-52
International Electronic Packaging Technical Conference and Exhibition <2002, Maui/Hawaii>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()