Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Flip chip technology for high temperature automotive applications
| International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Symposium on Microelectronics 2003. Proceedings : November 18 - 20, 2003, Hynes Convention Center, Boston, MA
Washington, DC: IMAPS, 2003 (SPIE Proceedings Series 5288)
ISBN: 0-930815-71-8
ISBN: 0-8194-5189-4
S.853-858 |
| International Symposium on Microelectronics <36, 2003, Boston/Mass.> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer IZM () |