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Particle free handling of substrates

CFM: Contamination Free Manufacturing
: Samadi, H.; Pfeffer, M.; Altmann, R.; Leibold, A.; Gumprecht, T.; Bauer, A.


Institute of Electrical and Electronics Engineers -IEEE-; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.; IEEE Electron Devices Society; IEEE Components, Packaging, and Manufacturing Technology Society:
26th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2015. Proceedings : 3-6 May 2015, Saratoga Springs, NY
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-9930-9
ISBN: 978-1-4799-9931-6
Advanced Semiconductor Manufacturing Conference (ASMC) <26, 2015, Saratoga Springs/NY>
Fraunhofer IISB ()

Semiconductor technology is heading towards the 10 nm node and even smaller in the coming years. This development relies not only on new process technologies, like lithography techniques, but also on safer and cleaner handling techniques that meet the high-end requirements of the production line. In this paper, the evaluation of different end-effectors and handling techniques regarding particle generation, organic and metallic contamination effects will be discussed. Bernoulli, carbon and standard vacuum end-effectors are being tested and compared with each other for the handling of 200 mm and 300 mm wafers.