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Advanced contamination control methods for yield enhancement. YE: Yield Enhancement/Learning

: Richter, H.; Leibold, A.; Altmann, R.; Doffek, B.; Koebl, J.; Pfeffer, M.; Bauer, A.; Schneider, G.; Cheung, D.


Institute of Electrical and Electronics Engineers -IEEE-; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.; IEEE Electron Devices Society; IEEE Components, Packaging, and Manufacturing Technology Society:
26th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2015. Proceedings : 3-6 May 2015, Saratoga Springs, NY
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-9930-9
ISBN: 978-1-4799-9931-6
Advanced Semiconductor Manufacturing Conference (ASMC) <26, 2015, Saratoga Springs/NY>
Fraunhofer IISB ()

Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control during and after the processes. Methods for detection of airborne and surface molecular contaminants were developed to meet the challenging requirements for More Moore and More than Moore applications. Qualitative and quantitative contamination analysis of organic and inorganic compounds allows monitoring of contamination in front-as well as back-end processes. In this way, cross contaminations including precious metals, e.g. Au, Ag, Pd, organic and inorganic compounds e.g. sulfur, fluorine can be avoided. By the use of state-of-the-art analytical systems, a contamination control for any cleanroom and all wafer sizes could be implemented.