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Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test

 
: Santos, R.; D'Agostino, D.; Soares, F.M.; Haghighi, H.R.; Williams, K.A.; Leijtens, X.J.M.

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IEEE Photonics Technology Letters 28 (2016), Nr.3, S.245-247
ISSN: 1041-1135
Englisch
Zeitschriftenaufsatz
Fraunhofer HHI ()

Abstract
In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.

: http://publica.fraunhofer.de/dokumente/N-382183.html