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Effect of bump height on the strain variation during the thermalcycling test of ACA flip-chip joints

 
: Pinardi, K.; Lai, Z.; Vogel, D.; Kang, Y.L.; Liu, J.; Liu, S.; Haug, R.; Willander, M.

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IEEE transactions on components and packaging technologies 23 (2000), Nr.3, S.447-451
ISSN: 1521-3331
Englisch
Zeitschriftenaufsatz
Fraunhofer IZM ()

Abstract
Flip chip joining using anisotropically conductive adhesive (ACA) has become a very attractive technique for electronics packaging. Many factors can influence the reliability of the ACA flip-chip joint. Bump height, is one of these factors. In this work, the strain development during the thermal cycling test of flip-chip joining with different bump heights was studied. The effect of bump height is significant in the interface between the bumps and the pads. Bigger volume area of high strain is found for higher bump in the interface between the bumps and the pads. Our calculations show that there is practically no effect of the bump height on the strain variation in the bumps and in the pads.

: http://publica.fraunhofer.de/dokumente/N-38023.html