English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Lead free solders for area array packaging
Details
Full
Export
Statistics
Options
2000
Conference Paper
Titel
Lead free solders for area array packaging
Author(s)
Jung, E.
Klöser, J.
Kallmayer, C.
Coskina, P.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
International Symposium on Microelectronics 2000. Proceedings
Konferenz
International Symposium on Microelectronics 2000
Language
English
google-scholar
View Details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM