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Laser joining of microcomponents with fiber lasers and diode lasers

: Gillner, A.; Bosse, L.; Kramer, T.; Olowinsky, A.; Wild, M.


Miyamoto, I. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
First International Symposium on Laser Precision Microfabrication 2000 : 14 - 16 June 2000, Omiya, Saitama, Japan / LPM 2000
Bellingham/Wash.: SPIE, 2000 (SPIE Proceedings Series 4088)
ISBN: 0-8194-3731-X
International Symposium on Laser Precision Microfabrication (LPM) <1, 2000, Omiya>
Fraunhofer ILT ()

The production of microsystems and miniaturized devices often requires joining technologies, which meet the demands of ultra clean manufacturing. Especially for optical and medical products low pollution and distortion joining processes are necessary to guarantee the quality and the function of the device. For this applications laser welding with fibre lasers at laser powers of up to P = 10 W and focus dimensions <30 m have been used for welding micro mechanical devices. At intensities I>106 W/cm2 welding depths of 100 m can be achieved with minimized pollution of the parts and smooth and clean appearance of the surface of the welds. For joining polymers and dissimilar materials high power diode lasers have been used providing even better conditions regarding pollution of the joining partners. By using material adapted laser wavelengths the heating of the material can be concentrated to the inner joining area of an overlap material joint. With this technique, ther moplastic polymer compounds and silicon glass compounds have been joined with low temperature and no influence on the quality of the parts with joining widths of less than 100 m.