
Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Simulation for fatigue, cracks and delamination
| Zhang, G.Q.: Benefiting from thermal and mechanical simulation in micro-electronics : Papers from the the first international conference; held at Eindhoven, The Netherlands, March 23 - 24, EuroSimE2000 Boston: Kluwer Academic Publishers, 2000 ISBN: 0-7923-7278-6 S.93-111 |
| International Conference on Benefiting from Thermal and Mechanical Simulation in Micro-Electronics (EuroSimE) <1, 2000, Eindhoven> |
|
| Englisch |
| Konferenzbeitrag |
| Fraunhofer IZM () |