Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

MMIC chipset for 300 GHz indoor wireless communication

 
: Kallfass, I.; Harati, P.; Dan, I.; Antes, J.; Boes, F.; Rey, S.; Merkle, T.; Wagner, S.; Massler, H.; Tessmann, A.; Leuther, A.

:

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2015. Proceedings : Tel Aviv, Israel, 2 - 4 November 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-7473-3
4 S.
International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS) <2015, Tel Aviv>
Englisch
Konferenzbeitrag
Fraunhofer IAF ()
millimeter-wave amplification; millimeter wave frequency conversion; MMICs; teraherzt wireless communication

Abstract
This contribution presents a full chip set dedicated to high data rate indoor wireless communication at a carrier frequency of 300 GHz. The analog frontend consists of a three-chip solution, namely a transmitter, receiver and local oscillator frequency multiplier. The active millimeter-wave monolithic integrated circuits are realized in a GaAs-based metamorphic high electron mobility transistor technology. The transmitter MMIC achieves a maximum output power of 3.6 dBm and an RF frequency range of 270 to 314 GHz. The receiver MMIC shows 11.4 dB conversion gain without IF amplification in an RF frequency range from 292 to 314 GHz.

: http://publica.fraunhofer.de/dokumente/N-377370.html