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  4. Aging-effects of polymeric encapsulation on the mechanical characteristics of solar panels and embedded components
 
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2014
Conference Paper
Title

Aging-effects of polymeric encapsulation on the mechanical characteristics of solar panels and embedded components

Abstract
Solar panels are exposed to varying external static and dynamic mechanical loads which determine the lifetime of the whole multilayered structure. The induced mechanical stresses are originate with weather phenomena such as wind, snow, and hail. Influences like these are strongly mechanically impacting on modules. Moreover, environmental parameters such as humidity and UV-radiation influence mechanical properties of module components in a yet not investigated way, thus influencing the modules' response to aforementioned stresses. The aging behavior - particularly the embrittlement - of the encapsulating polymer under UV-exposure was investigated using ethylene vinyl acetate (EVA) as an example. A detailed numeric model of a PV-module and its layer setup regarding front glass, encapsulation, silicon-cells and copper interconnectors was created.
Author(s)
Fromm, A.
Fraunhofer-Institut für Werkstoffmechanik IWM  
Trondl, A.
Fraunhofer-Institut für Werkstoffmechanik IWM  
Strecker, H.
Fraunhofer-Institut für Werkstoffmechanik IWM  
Krappitz, M.
Fraunhofer-Institut für Werkstoffmechanik IWM  
Thissen, D.
Fraunhofer-Institut für Werkstoffmechanik IWM  
Kübler, R.
Fraunhofer-Institut für Werkstoffmechanik IWM  
Mainwork
29th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2014  
Project(s)
Physikalische und werkstoffspezifische Grundlagen für Testverfahren zur Prüfung der mechanischen Zuverlässigkeit von Solarmodulen
Funder
Bundesministerium für Umwelt, Naturschutz, nukleare Sicherheit BMU
Conference
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2014  
DOI
10.24406/publica-r-390967
10.4229/EUPVSEC20142014-5BV.4.5
File(s)
N-375271.pdf (282.88 KB)
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
Keyword(s)
  • embrittlement

  • encapsulation

  • EVA

  • interconnector ribbon

  • dynamic mechanical loads

  • FEM-simulation

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