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Control of surface free energy by patterned etching or coating

 
: Eichler, M.; Nagel, K.; Reim, L.C.; Klages, C.-P.

Knechtel, Roy (Ed.) ; Fraunhofer-Institut für Schicht- und Oberflächentechnik -IST-, Braunschweig:
WaferBond 2015, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 7th - 9th December 2015, Braunschweig, Germany
Braunschweig, 2015
S.77-78
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2015, Braunschweig>
Englisch
Abstract
Fraunhofer IST ()

Abstract
Patterned atmospheric pressure plasma treatments were used to control free surface energy on silicon wafers before bonding. Surface energy measurements in situ during annealing are presented for SF6 etching as well as C4F8 and acetylene coatings. The bonding energy can be permanently reduced by appropriate coatings or surface roughness.

: http://publica.fraunhofer.de/dokumente/N-374800.html