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Application of polyelectrolyte multilayers for temporary wafer bonding

 
: Dillmann, H.; Eichler, M.; Klages, C.-P.

Knechtel, Roy (Ed.) ; Fraunhofer-Institut für Schicht- und Oberflächentechnik -IST-, Braunschweig:
WaferBond 2015, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 7th - 9th December 2015, Braunschweig, Germany
Braunschweig, 2015
S.39-40
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2015, Braunschweig>
Englisch
Abstract
Fraunhofer IST ()

Abstract
Polyelectrolyte multilayers (PEMs) deposited via layer-by-layer technique can be used as interfacial layers for temporary wafer bonding. Depending on the PEM combination appropriate bond strength as well as reduction of surface energy to facilitate debonding of wafer pairs can be achived at different annealing tempreatures.

: http://publica.fraunhofer.de/dokumente/N-374799.html