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Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C

 
: Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe

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IMAPS Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT). Online journal (2015), Issue HiTEN, S.5-9
http://imapsource.org/loi/apap
ISSN: 2380-4491
International Conference on High Temperature Electronics Network (HiTEN) <2015, Cambridge>
Englisch
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer IMS ()
EEPROM; High temperature; reliability; SPICE simulation; retention; endurance; oxide charge; SOI

Abstract
The paper presents reliability studies of single polysilicon EEPROM cells at temperatures from 50 °C to 450 °C. The technically challenging measurements at elevated temperatures above 250 °C have been carried out for accelerated reliability studies. Furthermore, a SPICE macro model has been extended to the wide temperature range to describe the retention and endurance performance of the memory cell and to enable a better insight into the physics involved

: http://publica.fraunhofer.de/dokumente/N-374361.html