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System integration for mobile communications

: Reichl, H.; Wolf, J.


Advanced engineering materials 3 (2001), Nr.10, S.803-809
ISSN: 1438-1656
ISSN: 1615-7508
Fraunhofer IZM ()

The research and development of electronic products is currently in a phase of upheaval. Microsystem technologies are the basis to realize highly miniaturized systems with varied functions, which were unthinkable a few years ago. Packaging technology plays a key role in the realization of this new generation of products. This requires the development of new technologies and materials, as well as new design software and the integration of electrical and electromechanical simulations at the stage of the system design.